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  • ATS-02A-128-C2-R0

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    The **ATS-02A-128-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, and other ICs. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 2.91°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 54mm x 54mm x 25mm | | **Fin Pattern** | Cross-Cut (Pin Fin) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Features The "electronic" relevance of this part lies in its thermal management capabilities: * **Heat Dissipation Mechanism:** The **cross-cut pin fin design** increases the surface area for convection. This is critical for high-density electronic assemblies where airflow direction may vary. * **Thermal Interface Material (TIM):** The part comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the electronic component (die/package) and the heat sink base, significantly reducing contact resistance. * **Push Pin Attachment:** It uses a spring-loaded push pin mechanism. This ensures constant, uniform pressure on the electronic component, which prevents damage to the silicon while maintaining optimal thermal contact. --- ### 3. Applications in Electronics This specific heat sink is commonly used in the following electronic environments: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Telecommunications:** Base station hardware where reliability is paramount. --- ### 4. Part Number Breakdown The part number follows a specific nomenclature: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **02A:** Series designation. * **128:** Specific physical dimensions/footprint code. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Revision or packaging code.
    ✨ Follow-up Questions
    • ⤷ What is the thermal conductivity of the T766 interface material used on this heat sink?
    • ⤷ How do I calculate the required airflow (LFM) for a specific chip power dissipation using this part?
    • ⤷ Does this heat sink support different spring tensions for sensitive BGA packages?