ATS-02A-128-C2-R0
AI

The **ATS-02A-128-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, and other ICs.
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic) |
| **Thermal Resistance** | 2.91°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 54mm x 54mm x 25mm |
| **Fin Pattern** | Cross-Cut (Pin Fin) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Key Electronic Components & Features
The "electronic" relevance of this part lies in its thermal management capabilities:
* **Heat Dissipation Mechanism:** The **cross-cut pin fin design** increases the surface area for convection. This is critical for high-density electronic assemblies where airflow direction may vary.
* **Thermal Interface Material (TIM):** The part comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the electronic component (die/package) and the heat sink base, significantly reducing contact resistance.
* **Push Pin Attachment:** It uses a spring-loaded push pin mechanism. This ensures constant, uniform pressure on the electronic component, which prevents damage to the silicon while maintaining optimal thermal contact.
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### 3. Applications in Electronics
This specific heat sink is commonly used in the following electronic environments:
* **Networking Equipment:** High-speed routers and switches.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Supplies:** Cooling MOSFETs or power regulators.
* **Telecommunications:** Base station hardware where reliability is paramount.
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### 4. Part Number Breakdown
The part number follows a specific nomenclature:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **02A:** Series designation.
* **128:** Specific physical dimensions/footprint code.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging code.
- ⤷
What is the thermal conductivity of the T766 interface material used on this heat sink?
- ⤷ How do I calculate the required airflow (LFM) for a specific chip power dissipation using this part?
- ⤷ Does this heat sink support different spring tensions for sensitive BGA packages?