The **ATS-02A-14-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 9.97°C/W @ (Unducted Flow) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Fin Configuration** | Fine Pitch (High performance) | --- ### 2. Key Electronic Features #### A. Thermal Management The primary role of this part is to dissipate heat generated by semiconductors (like CPUs, GPUs, or FPGAs). By increasing the surface area exposed to airflow, it prevents the electronic part from reaching its **Thermal Design Power (TDP)** limit, which would otherwise cause hardware throttling or failure. #### B. Push-Pin Attachment Mechanism Unlike adhesive-based heat sinks, the "02A" designation indicates a specific push-pin and spring assembly. * **Mechanical Stability:** Provides consistent pressure on the processor, ensuring optimal contact with the Thermal Interface Material (TIM). * **Vibration Resistance:** Securely locks into pre-drilled holes on the PCB, making it ideal for industrial or mobile electronics. #### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves corrosion resistance, which is vital for long-term reliability in electronic enclosures. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in selecting the right variant for a PCB design: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **02** | Push-pin style/size | | **A** | Aluminum material | | **14** | Fin pitch/designator | | **C2** | Specific kit/spring tension variant | | **R0** | RoHS compliant / Revision code | --- ### 4. Integration Considerations When designing this part into an electronic system, engineers must account for: 1. **Keep-out Zones:** The push-pins require holes in the PCB. 2. **Airflow Direction:** The fine-pitch fins are optimized for directed airflow (forced convection). 3. **TIM Selection:** Usually paired with a high-performance thermal pad or grease (pre-applied in some versions).