The **ATS-02A-141-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as CPUs, GPUs, and other high-power ICs. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Type** | Push-Pin (Plastic) | | **Fin Style** | Straight | | **Thermal Resistance** | 15.76 °C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Interface Material** | T766 (Thermal Tape) | | **Spring Type** | Brass | --- ## 2. Design Characteristics ### A. Fin Geometry The heat sink utilizes a **straight-fin** design. This is optimized for airflow that moves in a single direction across the component. The 10mm height makes it suitable for low-profile applications or compact PCB layouts. ### B. Attachment Mechanism Instead of using messy liquid adhesives, this part uses a **push-pin and spring** system: * **Pressure:** The springs provide consistent pressure against the chip, ensuring optimal heat transfer. * **Stability:** The push-pins lock into pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or shipping. ### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific thermal interface material applied to the base. It typically comes pre-applied with **T766**, a high-performance phase-change material or thermal tape, which eliminates the need for manual paste application. --- ## 3. Performance Data Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 15.76 | | 200 | 9.85 | | 300 | 7.63 | | 500 | 5.62 | --- ## 4. Typical Applications * **Telecommunications:** Cooling small processors in routers or switches. * **Embedded Systems:** Industrial PCs where space is limited. * **Power Electronics:** Cooling MOSFETs or voltage regulators.