The **ATS-02A-153-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" attachment series designed specifically for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Details | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 10mm (L x W x H) | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 11.95 °C/W (@ 1.0 m/s airflow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which offers high thermal conductivity while remaining lightweight. The blue anodized coating serves two purposes: 1. **Corrosion Resistance:** Protects the aluminum from oxidation. 2. **Radiation Efficiency:** Slightly improves heat dissipation through radiation compared to bare aluminum. #### B. Push-Pin Attachment Mechanism Instead of using adhesive tape or screws, this model uses a **plastic push-pin with a compression spring**. * **Purpose:** Provides consistent pressure on the component to ensure optimal contact with the heat source. * **Hole Pattern:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the component surface and the heat sink base, significantly reducing thermal resistance at the contact point. --- ### 3. Thermal Performance Analysis The efficiency of this heat sink is highly dependent on the "Velocity of Air" (LFM - Linear Feet per Minute). | Airflow (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 0.5 (Natural/Low) | 11.95 | | 1.0 | 6.40 | | 2.0 | 4.45 | | 3.0 | 3.53 | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Networking:** Routers and switches where high-density components generate significant heat. * **Power Electronics:** Cooling MOSFETs or voltage regulators.