ATS-02A-162-C2-R0
AI

The **ATS-02A-162-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices.
### 1. Technical Specifications
The following table summarizes the key physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Fin Style** | Straight (Cross-cut for optimized airflow) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 3.62 °C/W (at 100 LFM) |
| **Thermal Interface Material** | T766 (High performance) |
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### 2. Design and Component Breakdown
#### A. Fin Pattern and Airflow
The device uses a **straight-fin** geometry. The fins are precision-cut to provide maximum surface area while maintaining a low pressure drop. This design is ideal for systems with high-velocity airflow or forced-air cooling environments.
#### B. The pushPIN™ Attachment System
This is the mechanical "electronic part" of the assembly. Instead of using adhesive tape or standard screws, it utilizes:
* **Plastic/Brass Push Pins:** These snap into pre-drilled holes in the Printed Circuit Board (PCB).
* **Compression Springs:** These ensure a consistent, pre-measured pressure (load) is applied to the electronic chip, optimizing heat transfer without cracking the silicon die.
#### C. Thermal Interface Material (TIM)
The base comes pre-applied with **T766**. This is a phase-change or high-conductivity material that fills the microscopic air gaps between the heat sink and the electronic component to lower thermal impedance.
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### 3. Usage in Electronics
This heat sink is typically found in the following electronic applications:
1. **Networking Hardware:** Routers, switches, and base stations.
2. **Embedded Systems:** Industrial PCs and logic controllers.
3. **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).
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- ⤷
What are the PCB hole diameter requirements for the pushPIN™ system?
- ⤷ How does the thermal resistance of this part change at higher airflow velocities?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?