Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-02A-162-C2-R0

  • AI
    The **ATS-02A-162-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat surface-mount devices. ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Straight (Cross-cut for optimized airflow) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 3.62 °C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (High performance) | --- ### 2. Design and Component Breakdown #### A. Fin Pattern and Airflow The device uses a **straight-fin** geometry. The fins are precision-cut to provide maximum surface area while maintaining a low pressure drop. This design is ideal for systems with high-velocity airflow or forced-air cooling environments. #### B. The pushPIN™ Attachment System This is the mechanical "electronic part" of the assembly. Instead of using adhesive tape or standard screws, it utilizes: * **Plastic/Brass Push Pins:** These snap into pre-drilled holes in the Printed Circuit Board (PCB). * **Compression Springs:** These ensure a consistent, pre-measured pressure (load) is applied to the electronic chip, optimizing heat transfer without cracking the silicon die. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. This is a phase-change or high-conductivity material that fills the microscopic air gaps between the heat sink and the electronic component to lower thermal impedance. --- ### 3. Usage in Electronics This heat sink is typically found in the following electronic applications: 1. **Networking Hardware:** Routers, switches, and base stations. 2. **Embedded Systems:** Industrial PCs and logic controllers. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs). ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the pushPIN™ system?
    • ⤷ How does the thermal resistance of this part change at higher airflow velocities?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?