The **ATS-02A-176-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management series, designed to dissipate heat from electronic components like CPUs, GPUs, or power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Pitch** | Fine Pitch | | **Pattern** | Straight Fin | | **Thermal Resistance** | 8.59 °C/W (at 100 LFM) | --- ### 2. Design and Engineering Features ### A. Fin Geometry (Straight Fin) The part utilizes a **straight fin** design. This is optimized for environments with consistent airflow. The "Fine Pitch" arrangement maximizes surface area within a compact 35mm footprint, allowing for efficient heat transfer to the ambient air. ### B. Thermal Interface Material (TIM) The model typically comes with **T766** pre-applied thermal material. This ensures a high-quality thermal bond between the component (the heat source) and the aluminum base of the heat sink, reducing the thermal resistance at the contact point. ### C. Attachment Mechanism: pushPIN™ Instead of using messy adhesives or complex clips, this part uses the **pushPIN™ system**: * **Brass Components:** The pins are usually made of brass or durable plastic. * **Compression Springs:** Provides precise pressure (tension) to ensure the heat sink remains flush against the chip. * **Reliability:** This mechanical attachment is vibration-resistant, making it suitable for industrial or automotive applications. --- ### 3. Application Use Cases This specific heat sink is categorized for low-to-medium profile cooling requirements: * **Networking Gear:** Switches and routers where airflow is managed by chassis fans. * **Embedded Systems:** Industrial PCs where space is restricted (15mm height). * **Power Supplies:** Cooling MOSFETs or small power modules.