The **ATS-02A-189-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed specifically for thermal management in electronic assemblies where space and airflow optimization are critical. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-02A-189-C2-R0 | | **Material** | Aluminum (Body) / Copper (optional base plating) | | **Finish** | Blue Anodized | | **Fin Type** | Cross-Cut (providing multi-directional airflow) | | **Attachment Method** | pushPIN™ (Plastic/Brass pins with springs) | | **Thermal Resistance** | ~2.43 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | --- ### 2. Key Electronic Components & Design Features #### A. The Heat Sink Body (Thermal Dissipator) The core component is the aluminum structure. It utilizes a **Cross-Cut** fin pattern. Unlike straight-fin heat sinks, the cross-cut design allows for air to enter from multiple angles, making it highly effective in compact electronic enclosures where airflow direction may be turbulent or non-linear. #### B. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific type of Thermal Interface Material pre-applied to the base. * **Purpose:** It fills microscopic air gaps between the heat sink and the electronic component (CPU, GPU, or MOSFET) to ensure maximum heat transfer. * **Material:** Usually a high-performance phase-change material or thermal grease. #### C. pushPIN™ Attachment System This is the mechanical sub-assembly used to secure the part to the PCB. It consists of: * **Compression Springs:** These ensure constant, uniform pressure (Force) across the component. This prevents the heat sink from tilting and cracking the silicon die. * **Push-Pins:** These snap into pre-drilled holes in the PCB, allowing for tool-free installation and secure vibration resistance. --- ### 3. Usage Context in Electronics This part is typically used to cool: 1. **Application Specific Integrated Circuits (ASICs):** Used in networking hardware. 2. **FPGAs:** Which generate significant heat during high-speed processing. 3. **Power Modules:** Where thermal throttling must be avoided to maintain voltage stability. --- ### 4. Thermal Performance Data *Measured in °C/W (Lower is better)* | Airflow (LFM) | 100 (0.5 m/s) | 300 (1.5 m/s) | 500 (2.5 m/s) | | :--- | :---: | :---: | :---: | | **Thermal Resistance** | 2.43 | 1.42 | 1.10 |