The **ATS-02A-19-C2-R0** is a specific part number for a **High-Performance Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 54.00mm x 54.00mm | | **Height** | 20.00mm | | **Thermal Resistance** | 9.77°C/W (at 1.0 m/s airflow) | | **Attachment Method** | Push-Pin (Brass) | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Core Electronic/Thermal Features #### A. XCUT Fin Design The "XCUT" geometry refers to the cross-cut fin pattern. Unlike straight fins, this design creates a larger surface area and promotes turbulence in the airflow, which significantly enhances heat dissipation in multi-directional airflow environments. #### B. Attachment System (Push-Pins) The part uses a **Brass Push-Pin** mechanism with a **compression spring**. * **Purpose:** Ensures consistent pressure between the heat sink and the electronic chip. * **Benefit:** Improves the thermal contact and prevents the heat sink from shifting due to mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The **C2** in the part number indicates the specific thermal interface material. In this case, it comes with **T766** pre-applied to the base. * This material fills the microscopic air gaps between the component and the heat sink base to maximize heat transfer. --- ### 3. Part Number Breakdown (Naming Convention) To understand variations of this part, here is how the code is structured: | Segment | Meaning | | :--- | :--- | | **ATS-02** | Product Series (Push-Pin Heat Sinks) | | **A** | Material Type (Aluminum) | | **19** | Size/Designator code | | **C2** | Thermal Interface Material (T766) | | **R0** | Revision/Standard version | --- ### 4. Typical Applications This component is commonly found in: * **Networking Hardware:** Routers, switches, and bridges. * **Industrial PCs:** Cooling embedded processors in harsh environments. * **Power Electronics:** High-voltage regulators and power modules.