The **ATS-02A-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series and is designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 60.00 mm x 60.00 mm x 25.00 mm | | **Fin Pattern** | Straight Fin | | **Thermal Resistance** | 3.39 °C/W (@ 100 LFM) | | **Spring Type** | ATS-PPS-02 | --- ### 2. Key Component Features #### A. The Fin Design This model uses a **Straight Fin** design. Straight fins provide low pressure drop and are ideal for applications where there is a consistent, high-velocity airflow from a system fan. #### B. The pushPIN™ Attachment System One of the most critical "electronic parts" of this assembly is the mechanical attachment mechanism. It eliminates the need for messy adhesives or fragile clips. * **Push Pins:** Made of durable plastic or brass. * **Compression Springs:** These ensure "Firm Attachment," providing consistent pressure across the interface to maximize heat transfer. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **ATS-T766** thermal grease. This ensures that the microscopic gaps between the electronic chip and the aluminum heat sink are filled, reducing thermal resistance. --- ### 3. Application Use-Case This heat sink is typically used in the following electronic environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Cooling embedded processors in rugged environments. 3. **Power Electronics:** Managing heat for MOSFETs or IGBT modules. --- ### 4. Thermal Performance Comparison Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.39 | | 300 (1.5 m/s) | 2.08 | | 500 (2.5 m/s) | 1.62 | | 700 (3.5 m/s) | 1.41 |