The **ATS-02A-23-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It belongs to the **maxiFLOW™** series of high-performance heat sinks designed for cooling integrated circuits (ICs) and other electronic packages. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flowing Air)** | 12.01° C/W @ 100 LFM | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 15.00mm | | **Pin Pitch** | 1.43mm | --- ## Key Features and Construction ### 1. maxiFLOW™ Design The heat sink utilizes a spread-fin geometry. Unlike standard square fins, these fins expand outward, which maximizes the surface area for heat dissipation while maintaining a low pressure drop. This is particularly effective in environments with restricted airflow. ### 2. pushPIN™ Attachment The "R0" in the part number indicates the attachment hardware. This model uses the **pushPIN™** system, which consists of: * **Brass or Plastic Pins:** To secure the sink to the PCB. * **Compression Springs:** To provide precise, uniform pressure (load) on the component, ensuring optimal thermal contact. ### 3. Thermal Interface Material (TIM) The device typically comes pre-assembled with **Phase Change Material (PCM)** or high-performance thermal tape. This fills the microscopic air gaps between the CPU/GPU and the heat sink base. ### 4. Blue Anodized Finish The blue coating is not just aesthetic; anodizing increases the surface emissivity, which slightly improves radiative cooling and provides a protective layer against corrosion and electrical conductivity. --- ## Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **02A** | Specific pushPIN™ series/kit type | | **23** | Dimension/Fin Configuration code | | **C2** | Performance class / Thermal material spec | | **R0** | Revision or Packaging code (standard) | --- ## Applications * **BGA Cooling:** Ideal for Large Ball Grid Array (BGA) packages. * **Networking:** Used in routers, switches, and telecommunication hardware. * **Embedded Systems:** Industrial PCs where vertical clearance is limited (15mm height).