The **ATS-02A-31-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW" series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table summarizes the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 25.25°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 57.90mm x 36.83mm x 17.78mm | | **Flow Pattern** | maxiFLOW (Tapered Fin Design) | --- ## 2. Key Design Features ### pushPIN™ Attachment This model uses the proprietary **pushPIN™** mounting system. It consists of a flexible spring-loaded mechanism that ensures: * **Constant Pressure:** Maintains optimal thermal interface material (TIM) contact. * **Secure Fit:** Prevents the heat sink from shifting during vibration or shipping. * **Ease of Install:** No complex brackets or adhesives are required. ### maxiFLOW™ Fin Geometry The "maxiFLOW" design features a flared fin structure. Unlike standard rectangular heat sinks, the fins on this model taper outward. This increases the surface area and promotes better airflow through the fins, significantly reducing the pressure drop across the device. ### Thermal Performance (Airflow Efficiency) The efficiency of this heat sink changes based on the air velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 25.25 | | 200 | 14.65 | | 300 | 10.54 | | 400 | 8.41 | --- ## 3. Typical Applications This heat sink is commonly used in industrial and high-speed computing environments, including: * **Networking Equipment:** Routers and switches with high-density chips. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. ---