The **ATS-02A-36-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 14.82°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 22.86mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Design #### A. The Heat Sink Body The body is made of extruded aluminum, which provides a balance between weight and thermal conductivity. The **blue anodized finish** is not just for aesthetics; it increases the surface emissivity, slightly improving radiation heat transfer and protecting the metal from corrosion. #### B. Attachment Mechanism (Push-Pin & Spring) Unlike adhesive-based heat sinks, this model uses a mechanical fastening system: * **Push-Pins:** These insert into pre-drilled holes on the PCB (typically 3.0mm holes). * **Compression Springs:** These ensure constant pressure between the heat sink and the component, which is critical for maintaining an effective thermal contact. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the unit comes with **T766 phase-change material** pre-applied to the base. This material fills microscopic air gaps between the heat sink and the chip to maximize heat transfer efficiency. --- ### 3. Performance Analysis The efficiency of this part is highly dependent on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 14.82 | | **200 LFM (Forced)** | 5.34 | | **400 LFM (Forced)** | 3.59 | | **600 LFM (Forced)** | 2.80 | --- ### 4. Application Use Cases This specific model is commonly found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Cooling embedded processors in rugged environments. 3. **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators.