The **ATS-02A-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions** | 36.83mm x 36.83mm x 27.94mm | | **Fin Style** | Push-Pin (High flow design) | | **Thermal Resistance** | 6.42°C/W @ 100 LFM (Linear Feet per Minute) | | **Attachment Method** | Push-Pin with Compression Spring | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Components & Design The ATS-02A-38-C2-R0 is engineered with several critical design elements to optimize cooling: * **Heat Sink Body (Aluminum):** Provides high thermal conductivity while remaining lightweight. The blue anodized coating protects against corrosion and improves surface emissivity. * **Push-Pin Mounting System:** This is a mechanical attachment mechanism consisting of a plastic or metal pin and a spring. It ensures a consistent "clamping force" against the electronic chip for optimal heat transfer. * **T766 Thermal Interface Material (TIM):** This is a specialized layer pre-applied to the base of the heat sink. It fills microscopic air gaps between the heat sink and the electronic component, significantly reducing thermal resistance. * **Fin Geometry:** The fins are designed for "Straight Fin" or "Cross-Cut" airflow, allowing air from cooling fans to pass through with minimal pressure drop. --- ### 3. Applications This part is typically used in the following electronic sectors: 1. **Telecommunications:** For cooling high-speed network switches and routers. 2. **Embedded Systems:** For industrial motherboards where space is limited. 3. **Power Electronics:** For cooling high-voltage voltage regulators or MOSFETs. ---