The **ATS-02A-52-C3-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their *pushPIn™* series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat-generating integrated circuits. --- ### 1. Technical Specifications The part number is a coded string that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 35.0mm x 35.0mm x 25.0mm | | **Attachment Method** | pushPIN™ (Plastic or Brass) | | **Thermal Resistance** | Approx. 1.12°C/W (at 200 LFM) | | **Thermal Interface Material** | T412 (Pre-applied phase-change material) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific naming convention: 1. **ATS-02**: The series/housing type. 2. **A**: Refers to the specific heat sink profile or revision. 3. **52**: Represents the height (25mm) and specific fin density. 4. **C3**: Indicates the Thermal Interface Material (TIM) and spring type. 5. **R0**: Refers to the package quantity or specific revision code. --- ### 3. Key Electronic Cooling Components This assembly is not just a block of metal; it consists of several engineered sub-parts: #### A. The Heatsink (Extruded Fins) The core component is made of aluminum. It uses a "straight fin" or "cross-cut" design to maximize surface area. This allows air from a system fan to pass through and carry heat away from the silicon die. #### B. The pushPIN™ Attachment Unlike adhesive tapes, this part uses a mechanical push-pin system. * **Springs:** Provides consistent pressure (clamping force) on the processor, which is vital for efficient heat transfer. * **Pins:** Designed to fit into standard PCB (Printed Circuit Board) holes. #### C. Thermal Interface Material (TIM) The base of the ATS-02A-52-C3-R0 comes pre-applied with **T412**. This is a high-conductivity material that fills the microscopic air gaps between the component and the heatsink. --- ### 4. Application and Use Cases * **Embedded Systems:** Industrial PCs where vibration resistance is needed (provided by the push-pins). * **Telecommunications:** Used in routers and switches for cooling ASICs. * **Power Electronics:** Cooling MOSFETs or voltage regulators in high-density power supplies.