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  • ATS-02A-54-C2-R0

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    ### Technical Overview: ATS-02A-54-C2-R0 The **ATS-02A-54-C2-R0** is a high-performance **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed for efficient thermal management of electronic components such as CPUs, GPUs, and power transistors. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.00 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm | | **Fin Pattern** | Fine Pitch (Cross-Cut) | --- ### 2. Electronic/Thermal Components The assembly is more than just a block of metal; it consists of several engineered parts that work together to protect sensitive electronics: #### A. The Heat Sink Body * **Design:** It utilizes a square profile with a high-aspect-ratio fin design. The cross-cut pattern increases surface area, allowing for better airflow turbulence and heat dissipation. * **Material Choice:** Aluminum 6063 is used for its excellent thermal conductivity and lightweight properties. #### B. The pushPIN™ Attachment System * **Components:** Brass or plastic pins and stainless steel springs. * **Function:** This provides a precise and reliable attachment to the Printed Circuit Board (PCB). It ensures consistent pressure on the electronic chip, which is critical for maintaining an effective thermal interface. #### C. Thermal Interface Material (TIM) * **Type:** Pre-applied T766 phase-change material or similar. * **Function:** It fills microscopic air gaps between the chip (heat source) and the heat sink base, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific part is typically found in: 1. **Telecommunications Equipment:** For cooling high-speed signal processors. 2. **Embedded Systems:** Industrial PCs where space is limited but cooling demands are high. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data ```json { "airflow_velocity_LFM": [100, 200, 300, 400, 500], "thermal_resistance_CW": [7.00, 2.35, 1.40, 1.05, 0.85] } ``` ---
    ✨ Follow-up Questions
    • ⤷What are the specific PCB hole requirements for the pushPIN™ attachment?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance compared to bare aluminum?
    • ⤷ Is this heat sink compatible with custom thermal interface materials?