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  • ATS-02A-85-C3-R0

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    The **ATS-02A-85-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** designed for cooling electronic integrated circuits (ICs) and other components that generate heat during operation. Below is a detailed breakdown of its specifications and design features. --- ### 1. Technical Specifications The part number follows the specific naming convention of the manufacturer, **Advanced Thermal Solutions (ATS)**. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-02A-85-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Resistance** | 24.11° C/W (@ 100 LFM) | | **Flow Pattern** | Straight Fin | --- ### 2. Key Design Components #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses the **pushPIN™** system. * **Engagement:** It uses a spring-loaded mechanism that provides precise pressure for maximum thermal transfer. * **Reliability:** It is more secure than thermal tape and allows for easy removal or re-installation during maintenance. #### B. Material and Finish * **Aluminum 6063:** This is the industry standard for heat sinks due to its high thermal conductivity and lightweight properties. * **Blue Anodizing:** The blue finish is not just aesthetic; it provides surface protection against corrosion and increases thermal emissivity. #### C. Thermal Performance (Deg C/W) Thermal resistance indicates how effectively the part dissipates heat. Lower numbers are better. | Air Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 24.11 | 8.90 | 5.47 | --- ### 3. Applications This specific heat sink is typically used for: * **Northbridge/Southbridge** chips on motherboards. * **FPGAs and ASICs** in telecommunications equipment. * **LED lighting drivers** or high-speed networking switches. --- ### 4. Part Number Breakdown (Example) The suffix **C3** usually refers to the thermal interface material (TIM) or specific hardware used: * **ATS:** Advanced Thermal Solutions. * **02:** Series/Style designation. * **85:** Specific dimensions and fin configuration. * **C3:** Often indicates the use of a high-performance Phase Change Material (PCM) or specific spring tension. * **R0:** Revision code.
    ✨ Follow-up Questions
    • ⤷ What is the importance of LFM (Linear Feet per Minute) when choosing a heat sink?
    • ⤷ How does 'Anodizing' affect the thermal performance of aluminum parts?
    • ⤷ What is the difference between pushPIN and thermal adhesive attachment?