The **ATS-02A-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 13.30°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm | | **Height (Off Base)** | 12.70mm | | **Attachment Method** | Push-Pin (Spring Loaded) | --- ### 2. Key Design Features * **Fin Profile (Straight Fin):** The "87" in the part number refers to the specific fin design. Straight fins are optimized for applications where there is a consistent direction of airflow. * **pushPIN™ Attachment:** This model uses a specialized attachment system consisting of a plastic or metal pin and a compression spring. This ensures a precise "bolt-down" force (pressure) against the heat source, maximizing thermal transfer. * **Pre-Applied Thermal Interface Material (TIM):** Most "C3" variants come with a high-performance thermal pad or grease pre-applied to the base, simplifying the installation process. * **Blue Anodized Coating:** The blue finish isn't just aesthetic; anodization increases the surface emissivity and protects the aluminum from corrosion. --- ### 3. Thermal Performance Matrix The efficiency of the heatsink depends on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | 700 (3.5m/s) | | :--- | :--- | :--- | :--- | :--- | | **Thermal Res (Unducted)** | 13.30 °C/W | 4.74 °C/W | 2.85 °C/W | 2.16 °C/W | | **Thermal Res (Ducted)** | 2.48 °C/W | 1.61 °C/W | 1.33 °C/W | 1.16 °C/W | --- ### 4. Component Application This specific heatsink is ideal for: * **BGA Packages:** Large integrated circuits on PCBs. * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs where vertical space (12.7mm) is limited but cooling is critical.