The **ATS-02A-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series designed for cooling integrated circuits (ICs) and other PCB components. ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 2.50 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 21.90 °C/W (Natural Convection) | | **Dimensions** | 40mm x 40mm x 10mm | | **Pitch / Fin Pattern** | Fine Pitch / Straight Fin | --- ### 2. Design and Component Breakdown #### A. The Fin Design The "91" in the part number indicates a specific fin profile. This model uses a **Straight Fin** design with a **Fine Pitch**. - **Efficiency:** Fine pitch fins provide a larger surface area for heat dissipation but require a steady airflow (forced convection) to be effective. - **Low Profile:** At only 10mm in height, it is ideal for space-constrained electronic enclosures or 1U server racks. #### B. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the `pushPIN™` system ensures: - **Consistent Pressure:** The spring-loaded pins provide a defined "clamping force" to optimize the interface between the heat sink and the chip. - **Secure Mounting:** The pins lock into pre-drilled holes on the PCB (usually 3.0mm holes), making it resistant to shock and vibration. #### C. Thermal Interface Material (TIM) The **C3** designation indicates that this specific model usually comes pre-applied with high-performance **Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a low-resistance path for heat to travel from the component to the aluminum fins. --- ### 3. Typical Applications This part is commonly used for cooling high-heat-generating electronic components such as: * **CPUs and GPUs** in embedded systems. * **FPGAs** (Field Programmable Gate Arrays). * **ASICs** (Application-Specific Integrated Circuits). * **Northbridge/Southbridge** chipsets on motherboards.