The **ATS-02B-182-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and attachment method. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Fin Type** | Push-Pin (Straight Fin) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Attachment Method** | Push-Pin (Plastic) with Springs | | **Thermal Resistance** | ~7.51° C/W (at 100 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied thermal pad/paste) | --- ### 2. Breakdown of the Component Parts #### A. The Heat Sink Body The body is made of **Aluminum 6063**, which is the industry standard for thermal conductivity and weight. The "Blue Anodized" finish isn't just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiation cooling. #### B. The Push-Pin Fasteners Unlike adhesive-based heat sinks, this model uses a mechanical **Push-Pin and Spring** system: * **Pins:** Usually made of nylon or plastic, these snap into pre-drilled holes on the PCB. * **Springs:** These provide a precise amount of downward pressure (compression force) to ensure maximum contact between the chip and the heat sink. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates the specific thermal interface material applied to the base. The **T766** material is a high-performance phase-change material that fills microscopic air gaps between the component and the sink. --- ### 3. Thermal Performance Analysis Performance is measured by **Thermal Resistance (°C/W)**. A lower value means the heat sink is more efficient at dissipating heat. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low) | 7.51 | | 300 (Medium) | 3.82 | | 500 (High) | 3.07 | --- ### 4. Implementation Code (Example) In a thermal simulation or BOM (Bill of Materials) management system, you might define this part's physical footprint in a Python-based hardware description or CAD script: ```python # Definition for ATS-02B-182-C2-R0 for Thermal Analysis heat_sink_data = { "part_number": "ATS-02B-182-C2-R0", "dimensions": {"length": 40, "width": 40, "height": 15}, "material": "Aluminum 6063", "mounting": "Push-Pin", "hole_pattern": "32.0mm x 32.0mm", "interface_material": "T766" } ``` ---