ATS-02B-75-C3-R0
AI

The **ATS-02B-75-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits (ICs).
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Dimensions** | 45mm x 45mm x 30mm |
| **Finish** | Blue Anodized |
| **Mounting Style** | Push Pin (Plastic) |
| **Attachment Type** | Compression Spring |
| **Thermal Resistance** | ~1.71°C/W (at 200 LFM) |
| **Weight** | ~65 grams |
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### 2. Key Design Components
#### A. Fin Geometry (Straight Fin)
This model uses a **Straight Fin** design. This is optimized for systems with a steady, directed airflow (forced convection). The spacing between the fins allows for maximum surface area while maintaining a low pressure drop.
#### B. Push Pin Attachment
The "02B" in the part number indicates the specific push pin and spring assembly.
- **Tool-less Installation:** It uses a flexible plastic pin that snaps into pre-drilled holes on the PCB (typically 3.0mm holes).
- **Consistent Pressure:** The built-in spring ensures uniform pressure across the component interface, which optimizes thermal transfer and prevents mechanical damage.
#### C. Thermal Interface Material (TIM)
The "R0" suffix usually denotes the inclusion of a pre-applied **Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a clean and efficient thermal bond between the chip and the aluminum base.
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### 3. Application Use Cases
The ATS-02B-75-C3-R0 is commonly used in:
* **Networking Equipment:** Switches and routers where high-speed processors generate significant heat.
* **Industrial PCs:** Compact systems requiring reliable passive or active cooling.
* **Power Supplies:** Cooling MOSFETs or power conversion modules.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **02B:** Specific Push-Pin and Spring kit configuration.
* **75:** Refers to the specific fin pattern/density.
* **C3:** Blue Anodized finish.
* **R0:** Standard packaging with pre-applied TIM.
- ⤷
What is the thermal resistance of this heat sink under natural convection versus forced airflow?
- ⤷ How do I determine if the 45mm x 45mm footprint is compatible with my PCB layout?
- ⤷ What are the alternatives to push-pin mounting for this specific heat sink model?