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  • ATS-02B-75-C3-R0

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    The **ATS-02B-75-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits (ICs). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Dimensions** | 45mm x 45mm x 30mm | | **Finish** | Blue Anodized | | **Mounting Style** | Push Pin (Plastic) | | **Attachment Type** | Compression Spring | | **Thermal Resistance** | ~1.71°C/W (at 200 LFM) | | **Weight** | ~65 grams | --- ### 2. Key Design Components #### A. Fin Geometry (Straight Fin) This model uses a **Straight Fin** design. This is optimized for systems with a steady, directed airflow (forced convection). The spacing between the fins allows for maximum surface area while maintaining a low pressure drop. #### B. Push Pin Attachment The "02B" in the part number indicates the specific push pin and spring assembly. - **Tool-less Installation:** It uses a flexible plastic pin that snaps into pre-drilled holes on the PCB (typically 3.0mm holes). - **Consistent Pressure:** The built-in spring ensures uniform pressure across the component interface, which optimizes thermal transfer and prevents mechanical damage. #### C. Thermal Interface Material (TIM) The "R0" suffix usually denotes the inclusion of a pre-applied **Thermal Interface Material**. This eliminates the need for manual application of thermal paste, ensuring a clean and efficient thermal bond between the chip and the aluminum base. --- ### 3. Application Use Cases The ATS-02B-75-C3-R0 is commonly used in: * **Networking Equipment:** Switches and routers where high-speed processors generate significant heat. * **Industrial PCs:** Compact systems requiring reliable passive or active cooling. * **Power Supplies:** Cooling MOSFETs or power conversion modules. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **02B:** Specific Push-Pin and Spring kit configuration. * **75:** Refers to the specific fin pattern/density. * **C3:** Blue Anodized finish. * **R0:** Standard packaging with pre-applied TIM.
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink under natural convection versus forced airflow?
    • ⤷ How do I determine if the 45mm x 45mm footprint is compatible with my PCB layout?
    • ⤷ What are the alternatives to push-pin mounting for this specific heat sink model?