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  • ATS-02D-101-C2-R0

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    The **ATS-02D-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). ### Technical Specifications Below is a breakdown of the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Part Number** | ATS-101 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Style** | Straight (Square Pin) | | **Thermal Resistance** | 6.69°C/W (Natural Flow) | --- ### Component Features #### 1. pushPIN™ Attachment This part uses a specific mounting mechanism called **pushPIN™**. It consists of a brass or plastic pin combined with a compression spring. This design ensures: * **Constant Pressure:** Provides uniform contact between the heat sink and the component (like a CPU or GPU). * **Ease of Install:** Quick installation into pre-drilled holes on a PCB. #### 2. Thermal Interface Material (TIM) The "C2" suffix in the part number typically indicates that the heat sink comes pre-applied with **T766 phase-change material**. This fills the microscopic air gaps between the heat sink and the electronic chip to improve heat transfer. #### 3. Fin Design The **straight fin** or **cross-cut** design is optimized for specific airflow environments. Because it is 30mm tall, it is considered a mid-to-high profile sink, suitable for systems with moderate vertical clearance. ### Application Use Cases This heat sink is commonly used for cooling high-heat-generating electronic components such as: * **BGA (Ball Grid Array) Packages** * **ASICs and FPGAs** * **Network Switches and Routers** * **Power Supplies** --- ### Thermal Performance Overview Thermal resistance decreases as airflow (Measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 6.69 | | 300 | 1.5 | 1.74 | | 500 | 2.5 | 1.15 |
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required for the pushPIN mounting on this model?
    • ⤷ How does the blue anodized finish affect the heat dissipation compared to bare aluminum?
    • ⤷ Can this heat sink be used with a custom fan attachment?