The **ATS-02D-182-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 7.51°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number is coded to represent specific features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **02**: Attachment type (Push-Pin). * **D**: Spring type (typically refers to the compression force). * **182**: Fin pattern/Specific design geometry. * **C2**: Material and Finish (Aluminum with Blue Anodized coating). * **R0**: RoHS compliance status. --- ### 3. Key Electronic/Thermal Features * **Fin Design**: It utilizes a **Fine Pitch** straight fin or cross-cut design (depending on the specific 182-series revision) to maximize surface area within a compact 40mm footprint. * **Push-Pin Mounting**: This part features a spring-loaded push-pin mechanism. This ensures consistent pressure between the heat sink and the electronic component, which is critical for maximizing heat transfer. * **T766 Thermal Interface**: The "C2" variant comes with pre-applied T766 phase-change material. This fills microscopic air gaps between the component and the heat sink, significantly lowering thermal impedance. * **Airflow Optimization**: The 15mm height is designed for "Low Profile" applications, such as 1U rack servers or compact embedded systems where vertical space is limited. --- ### 4. Applications This heat sink is commonly used for: 1. **Networking Hardware**: Routers, switches, and high-speed modems. 2. **Power Supplies**: Dissipating heat from MOSFETs or Voltage Regulators. 3. **Industrial PC (IPC)**: Cooling processors in fanless or high-airflow enclosures.