ATS-02F-05-C2-R0
AI

The **ATS-02F-05-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits.
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### 1. Technical Specifications
Below are the primary mechanical and thermal characteristics of this part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Plastic Pins & Springs) |
| **Thermal Resistance** | 8.72°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 40.00 mm x 40.00 mm |
| **Height (H)** | 25.00 mm |
| **Pitch** | 1.14 mm (Approx.) |
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### 2. Key Features and Components
The part is engineered for specific electronic cooling environments:
* **Fine Pitch Fin Design:** The "F" in the part number denotes a fine pitch fin pattern. This increases the surface area for heat dissipation, making it ideal for high-velocity airflow environments.
* **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, it uses a standardized push-pin system with a compression spring. This ensures:
* **Consistent Pressure:** Optimizes the contact between the heat sink and the component.
* **Easy Installation:** Tool-free mounting into pre-drilled PCB holes.
* **Blue Anodized Finish:** Provides a protective oxide layer that prevents corrosion and slightly improves thermal emissivity.
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### 3. Thermal Performance Profile
The effectiveness of this heat sink depends on the airflow (LFM - Linear Feet per Minute) within the enclosure:
| Airflow Velocity | Thermal Resistance (Unducted) |
| :--- | :--- |
| **100 LFM (0.5 m/s)** | 8.72 °C/W |
| **300 LFM (1.5 m/s)** | 2.95 °C/W |
| **500 LFM (2.5 m/s)** | 1.58 °C/W |
| **700 LFM (3.5 m/s)** | 1.14 °C/W |
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### 4. Part Number Breakdown
The nomenclature **ATS-02F-05-C2-R0** can be decoded as follows:
* **ATS**: Advanced Thermal Solutions (Manufacturer).
* **02**: Part Series.
* **F**: Fine Pitch fin configuration.
* **05**: Specific dimension/geometry code.
* **C2**: Thermal Interface Material (TIM) type (often pre-applied).
* **R0**: RoHS compliance status/Revision.
- ⤷
What are the PCB hole diameter requirements for the pushPIN mounting system?
- ⤷ Does this model come with a pre-applied Thermal Interface Material (TIM)?
- ⤷ How does fine pitch compare to coarse pitch fin designs in low-airflow environments?