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  • ATS-02F-05-C2-R0

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    The **ATS-02F-05-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance** | 8.72°C/W (at 100 LFM) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (H)** | 25.00 mm | | **Pitch** | 1.14 mm (Approx.) | --- ### 2. Key Features and Components The part is engineered for specific electronic cooling environments: * **Fine Pitch Fin Design:** The "F" in the part number denotes a fine pitch fin pattern. This increases the surface area for heat dissipation, making it ideal for high-velocity airflow environments. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, it uses a standardized push-pin system with a compression spring. This ensures: * **Consistent Pressure:** Optimizes the contact between the heat sink and the component. * **Easy Installation:** Tool-free mounting into pre-drilled PCB holes. * **Blue Anodized Finish:** Provides a protective oxide layer that prevents corrosion and slightly improves thermal emissivity. --- ### 3. Thermal Performance Profile The effectiveness of this heat sink depends on the airflow (LFM - Linear Feet per Minute) within the enclosure: | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 8.72 °C/W | | **300 LFM (1.5 m/s)** | 2.95 °C/W | | **500 LFM (2.5 m/s)** | 1.58 °C/W | | **700 LFM (3.5 m/s)** | 1.14 °C/W | --- ### 4. Part Number Breakdown The nomenclature **ATS-02F-05-C2-R0** can be decoded as follows: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **02**: Part Series. * **F**: Fine Pitch fin configuration. * **05**: Specific dimension/geometry code. * **C2**: Thermal Interface Material (TIM) type (often pre-applied). * **R0**: RoHS compliance status/Revision.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the pushPIN mounting system?
    • ⤷ Does this model come with a pre-applied Thermal Interface Material (TIM)?
    • ⤷ How does fine pitch compare to coarse pitch fin designs in low-airflow environments?