ATS-02F-34-C2-R0
AI

The **ATS-02F-34-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, typically semiconductors like CPUs, GPUs, or power transistors, where space is tight and thermal efficiency is critical.
### 1. Technical Specifications
The following table highlights the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimension (L x W x H)** | 17.2mm x 17.2mm x 25mm |
| **Mounting Style** | pushPIN™ |
| **Spring Type** | Brass (Nickel Plated) |
| **Thermal Resistance** | 6.73°C/W (at 100 LFM) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Features and Design
The part belongs to the **pushPIN™** series, which is characterized by a specific set of design choices:
* **Miniature Footprint:** With a base size of 17.2mm x 17.2mm, it is designed for small-form-factor electronics or dense PCB layouts.
* **High Aspect Ratio Fins:** The "F" in the part number often indicates a specific fin density designed to maximize surface area for heat dissipation in forced air environments.
* **Attachment Mechanism:** The pushPIN™ system uses a spring-loaded mechanism that provides a consistent, precise pressure (load) on the component. This ensures optimal contact with the Thermal Interface Material (TIM).
* **Pre-Applied TIM:** It comes with **T766** thermal grease already applied to the base, reducing assembly time and ensuring a uniform layer for heat transfer.
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### 3. Part Number Breakdown
The part number follows a specific nomenclature used by ATS:
1. **ATS**: Manufacturer (Advanced Thermal Solutions).
2. **02**: Product Series (pushPIN™ Heat Sink).
3. **F**: Fin Pitch/Density type.
4. **34**: Specific internal design/size code.
5. **C2**: Material/Finish code (Blue Anodized Aluminum).
6. **R0**: Revision/Packaging code.
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### 4. Thermal Performance
Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 6.73 |
| 200 | 3.57 |
| 300 | 2.79 |
| 400 | 2.42 |
- ⤷
What are the PCB hole requirements for the pushPIN™ mounting system?
- ⤷ Is this heat sink suitable for passive cooling (natural convection)?
- ⤷ Can the T766 thermal interface material be replaced with a phase-change material?