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  • ATS-02F-34-C2-R0

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    The **ATS-02F-34-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, typically semiconductors like CPUs, GPUs, or power transistors, where space is tight and thermal efficiency is critical. ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimension (L x W x H)** | 17.2mm x 17.2mm x 25mm | | **Mounting Style** | pushPIN™ | | **Spring Type** | Brass (Nickel Plated) | | **Thermal Resistance** | 6.73°C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Design The part belongs to the **pushPIN™** series, which is characterized by a specific set of design choices: * **Miniature Footprint:** With a base size of 17.2mm x 17.2mm, it is designed for small-form-factor electronics or dense PCB layouts. * **High Aspect Ratio Fins:** The "F" in the part number often indicates a specific fin density designed to maximize surface area for heat dissipation in forced air environments. * **Attachment Mechanism:** The pushPIN™ system uses a spring-loaded mechanism that provides a consistent, precise pressure (load) on the component. This ensures optimal contact with the Thermal Interface Material (TIM). * **Pre-Applied TIM:** It comes with **T766** thermal grease already applied to the base, reducing assembly time and ensuring a uniform layer for heat transfer. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **02**: Product Series (pushPIN™ Heat Sink). 3. **F**: Fin Pitch/Density type. 4. **34**: Specific internal design/size code. 5. **C2**: Material/Finish code (Blue Anodized Aluminum). 6. **R0**: Revision/Packaging code. --- ### 4. Thermal Performance Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 6.73 | | 200 | 3.57 | | 300 | 2.79 | | 400 | 2.42 |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN™ mounting system?
    • ⤷ Is this heat sink suitable for passive cooling (natural convection)?
    • ⤷ Can the T766 thermal interface material be replaced with a phase-change material?