The **ATS-02F-40-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, typically Integrated Circuits (ICs) such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table highlights the key physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 14.56°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Fin Style** | Straight (Cross-Cut) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS to identify the component's features: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **02**: Series (referring to the heat sink family). * **F**: Performance category (High-performance fin design). * **40**: Base dimension (40mm width/length). * **C2**: Material/Finish code (Blue Anodized Aluminum). * **R0**: Revision/Packaging code. --- ### 3. Key Electronic Cooling Features #### **Push-Pin Attachment** Unlike adhesive-based heat sinks, the ATS-02F-40-C2-R0 uses a **Push-Pin** system with a brass spring. This provides: * **Consistent Pressure:** Ensures the thermal interface material (TIM) is compressed evenly for better heat transfer. * **Mechanical Stability:** Securely holds the heat sink in high-vibration environments. * **Ease of Maintenance:** Can be removed and reinstalled without damaging the PCB. #### **Cross-Cut Fin Design** The fins are cut in both horizontal and vertical directions. This design allows for **multi-directional airflow**, meaning the heat sink remains effective regardless of which direction the fan is blowing across the board. #### **Thermal Interface Material (TIM)** This part usually comes pre-applied with **ATS-PPS-11**, a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink base to maximize thermal conductivity. --- ### 4. Ideal Applications * **Networking Hardware:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and single-board computers (SBCs). * **Power Electronics:** Voltage regulators and power supplies. ---