The **ATS-02F-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "push pin" series designed for securing cooling solutions to PCBs. --- ### 1. Technical Specifications The following table breaks down the core physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 2.85°C/W (at 200 LFM) | | **Flow Orientation** | Vertical Fin (Cross-cut) | --- ### 2. Key Component Features * **Cross-Cut Fin Design:** The fins are cut both ways (grid-like). This allows for multidirectional airflow, making it efficient even if the air is not coming from a single fixed direction. * **Push-Pin Attachment:** Instead of using adhesive tape or screws, it uses plastic push-pins and springs. This ensures a consistent **pressure (clamping force)** against the chip, which improves thermal transfer and makes the part reusable. * **Pre-applied Thermal Interface Material (TIM):** Most variants in this series come with a "T766" phase-change material or similar thermal pad pre-applied to the base to ensure immediate contact efficiency. --- ### 3. Application Use Cases This specific heat sink is typically used for cooling integrated circuits (ICs) that generate moderate heat, such as: 1. **FPGA/ASIC chips:** High-speed processing units in networking gear. 2. **Northbridge/Southbridge:** Chipsets on industrial motherboards. 3. **Power Supplies:** Regulators requiring passive or active airflow cooling. 4. **Embedded Systems:** Small form factor computers where vertical clearance is limited to 20mm. --- ### 4. Thermal Performance Breakdown The efficiency of this part depends heavily on the **Air Velocity** (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (Active)** | 2.85 | | **400 (Active)** | 1.80 | | **600 (Active)** | 1.45 | | **Unducted (Natural)** | ~6.50 |