The **ATS-02F-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 9.39°C/W (Unducted) | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## Key Design Components ### 1. The Fin Profile (Straight Fin) The "64" in the part number indicates a specific fin pattern. Straight fin designs are ideal for systems with high-speed airflow. The aluminum construction ensures rapid heat transfer from the base to the fins. ### 2. pushPIN™ Attachment System This part utilizes a spring-loaded push-pin mechanism. - **Efficiency:** Provides precise pressure for optimal contact between the heat sink and the chip. - **Reliability:** The springs ensure consistent pressure even under mechanical vibration or thermal expansion. ### 3. Thermal Interface Material (T766) The unit comes with **T766** pre-applied to the base. This is a high-conductivity thermal paste/pad that fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance. ### 4. Blue Anodized Coating The blue anodization is not just for aesthetics; it provides: - **Corrosion Resistance:** Protects the aluminum from oxidation. - **Emissivity:** Slightly improves heat radiation compared to raw aluminum. --- ## Physical Dimensions | Dimension | Value | | :--- | :--- | | **Size (Length x Width)** | 45mm x 45mm | | **Height** | 25mm | | **Hole Spacing** | 38mm | --- ## Application Use Cases * **Networking Equipment:** Routers, switches, and high-speed modems. * **Industrial PCs:** Compact motherboards requiring active or passive cooling. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators (VRMs) in power supplies.