The **ATS-02F-67-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "Blue Anodized" push-pin series designed for cooling electronic components like CPUs, GPUs, and ASICs. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 10mm | | **Thermal Resistance** | 20.30 °C/W (at 0 LFM) to 2.30 °C/W (at 800 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ## Key Electronic & Mechanical Components #### 1. Thermal Interface Material (T766) This is the "electronic" bridge between the semiconductor and the heat sink. The **T766** compound is a phase-change material designed to fill microscopic air gaps between the chip and the aluminum base, ensuring maximum heat transfer efficiency. #### 2. Push-Pin Attachment System Instead of using adhesive tape (which can act as an insulator), this part uses a mechanical push-pin system. * **Plastic Pins:** Non-conductive, preventing electrical shorts on the PCB. * **Compression Springs:** Provide specific downward pressure to maintain optimal contact with the heat source. #### 3. Fin Profile (Straight Fin) The fins are designed to facilitate **cross-flow cooling**. This makes the part ideal for systems with directed airflow (fans), as the straight-line architecture offers low pressure drop, allowing air to pass through the fins easily. --- ### ## Application Context This part is typically found in: * **Networking Hardware:** Cooling high-speed switches and routers. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. * **Power Electronics:** Dissipating heat from MOSFET arrays or small power modules.