The **ATS-02F-69-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by *Advanced Thermal Solutions, Inc.* --- ### 1. Technical Specifications The following table highlights the core technical properties of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (Off Base)** | 20mm | | **Thermal Resistance** | 11.56°C/W (at 100 LFM) | | **Fin Pattern** | Straight Fin | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment System The "02F" in the part number indicates the specific push-pin and spring mechanism used to mount the heatsink to the PCB. * **Ease of Assembly:** Features a flexible attachment system that allows for tool-free or simple tool installation. * **Constant Pressure:** The pre-assembled springs ensure consistent pressure across the thermal interface material (TIM), maximizing heat transfer. #### B. Material and Thermal Interface * **Aluminum Construction:** Offers a balance between weight, cost, and high thermal conductivity. * **Blue Anodized Finish:** This is not just aesthetic; anodizing increases surface emissivity, which improves heat radiation and protects the aluminum from corrosion. #### C. Performance Characteristics The thermal resistance of this unit varies significantly based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 11.56 | | 300 | 3.33 | | 500 | 2.11 | --- ### 3. Application Use Cases The ATS-02F-69-C2-R0 is typically used in environments where space is moderate but heat dissipation is critical: 1. **Telecommunications:** Cooling line cards and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Cooling MOSFETs or small power modules. 4. **Processors:** Low-to-mid TDP (Thermal Design Power) CPUs or FPGAs. ---