The **ATS-02F-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power semiconductors. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 6.69°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Features The "C2" and "R0" designations in the part number refer to specific material and finish configurations: * **Straight Fin Profile:** The fins are aligned in a parallel fashion, which is ideal for systems with directed airflow (forced convection). * **Push Pin Attachment:** This part uses a spring-loaded plastic push pin mechanism. This ensures consistent pressure between the heat sink and the electronic component, which optimizes heat transfer. * **T766 Thermal Interface:** It comes with a pre-applied phase-change thermal pad, eliminating the need for manual thermal paste application during assembly. * **Blue Anodized Coating:** This finish provides both corrosion resistance and a slight increase in emissivity for radiative heat transfer. --- ### 3. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 6.69 | | 400 (2.0 m/s) | 3.28 | | 600 (3.0 m/s) | 2.50 | | 800 (4.0 m/s) | 2.10 | --- ### 4. Component Application This heat sink is typically used for: * **ASICs and FPGAs:** Large-scale integrated circuits that generate significant localized heat. * **Embedded Systems:** Industrial PCs where mechanical stability (via push pins) is required. * **Power Supplies:** Cooling voltage regulators or power transistors.