Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-02F-75-C1-R0

  • AI
    The **ATS-02F-75-C1-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in compact electronic assemblies. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (High Performance) | | **Fin Type** | XC-Cut (Cross-cut) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 1.48 °C/W (at 200 LFM) | | **Finish** | Blue Anodized | | **Thermal Interface** | T766 (Pre-applied) | --- ### 2. Key Design Features #### **A. XC-Cut Fin Profile** The "XC-Cut" refers to a straight-fin design that has been cross-cut. This creates a matrix of pins/blocks rather than continuous walls. * **Benefit:** This allows for omnidirectional airflow, meaning the heat sink performs well even if the air is not blowing directly parallel to the fins. #### **B. pushPIN™ Attachment** Instead of using messy adhesives or thermal tape, this part uses a spring-loaded "pushPIN" mechanism. * **Benefit:** Provides consistent pressure on the processor or component, ensuring optimal thermal contact while preventing damage from over-tightening. #### **C. Material & Coating** * **Aluminum 6063:** Chosen for its high thermal conductivity and structural integrity. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves surface emissivity (radiant heat transfer). --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code `ATS-02F-75-C1-R0`: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **02F** | Product Series / Family Identifier | | **75** | Specific geometry/height configuration | | **C1** | Thermal Interface Material (T766) | | **R0** | Revision / Finish (Blue Anodized) | --- ### 4. Applications This heat sink is typically found in: * **Embedded Systems:** Industrial PCs and controllers. * **Networking:** Routers, switches, and high-speed hubs. * **Power Electronics:** Cooling MOSFETs or small DC-DC converters.
    ✨ Follow-up Questions
    • ⤷ What are the alternative thermal interface materials available for this heat sink?
    • ⤷ How do I calculate the airflow requirements for a 1.48 °C/W thermal resistance?
    • ⤷ Does the pushPIN mechanism require a specific PCB hole pattern?