ATS-02F-75-C1-R0
AI

The **ATS-02F-75-C1-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in compact electronic assemblies.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | pushPIN™ (High Performance) |
| **Fin Type** | XC-Cut (Cross-cut) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 25mm |
| **Thermal Resistance** | 1.48 °C/W (at 200 LFM) |
| **Finish** | Blue Anodized |
| **Thermal Interface** | T766 (Pre-applied) |
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### 2. Key Design Features
#### **A. XC-Cut Fin Profile**
The "XC-Cut" refers to a straight-fin design that has been cross-cut. This creates a matrix of pins/blocks rather than continuous walls.
* **Benefit:** This allows for omnidirectional airflow, meaning the heat sink performs well even if the air is not blowing directly parallel to the fins.
#### **B. pushPIN™ Attachment**
Instead of using messy adhesives or thermal tape, this part uses a spring-loaded "pushPIN" mechanism.
* **Benefit:** Provides consistent pressure on the processor or component, ensuring optimal thermal contact while preventing damage from over-tightening.
#### **C. Material & Coating**
* **Aluminum 6063:** Chosen for its high thermal conductivity and structural integrity.
* **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides electrical insulation and improves surface emissivity (radiant heat transfer).
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### 3. Part Number Breakdown (Nomenclature)
Understanding the code `ATS-02F-75-C1-R0`:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **02F** | Product Series / Family Identifier |
| **75** | Specific geometry/height configuration |
| **C1** | Thermal Interface Material (T766) |
| **R0** | Revision / Finish (Blue Anodized) |
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### 4. Applications
This heat sink is typically found in:
* **Embedded Systems:** Industrial PCs and controllers.
* **Networking:** Routers, switches, and high-speed hubs.
* **Power Electronics:** Cooling MOSFETs or small DC-DC converters.
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What are the alternative thermal interface materials available for this heat sink?
- ⤷ How do I calculate the airflow requirements for a 1.48 °C/W thermal resistance?
- ⤷ Does the pushPIN mechanism require a specific PCB hole pattern?