The **ATS-02F-79-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **blueICE™** series and is specifically designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic Pins) | | **Dimensions** | 25mm x 25mm x 30mm | | **Thermal Resistance** | 2.63°C/W (at 200 LFM) | | **Flow Direction** | Vertical (Cross-Cut) | | **Spring Type** | Stainless Steel (R0 suffix) | --- ### 2. Key Electronic Features #### A. Thermal Management The primary purpose of this part is to dissipate heat generated by integrated circuits (ICs). By increasing the surface area using a "cross-cut" fin design, it facilitates efficient heat transfer into the surrounding air via convection. #### B. pushPIN™ Attachment System This part uses a specialized mounting system consisting of: * **Compression Springs:** Provides specific pressure to ensure maximum contact between the chip and the heat sink. * **Plastic Push Pins:** Designed for easy installation into pre-drilled holes on a PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **T766 Phase Change Material**. This fills microscopic air gaps between the component and the heat sink to reduce thermal resistance. --- ### 3. Application Use Cases 1. **Telecommunications:** Used in routers and switches to cool high-speed processing chips. 2. **Embedded Systems:** Ideal for compact industrial PC builds where vertical airflow is available. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Mechanical Drawing Reference While a full CAD drawing is unavailable here, the dimensions are critical for PCB layout: * **Length/Width:** 25.00 mm * **Height:** 30.00 mm (Tall profile for high airflow environments) * **Pitch:** The distance between the pushPIN holes is typically optimized for standard BGA patterns.