ATS-02F-82-C2-R0
AI

The **ATS-02F-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for efficient heat dissipation in compact electronic systems.
### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-02F-82-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 10.79°C/W (Natural Convection) |
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### Core Components & Features
#### 1. Material and Construction
* **Aluminum Body:** Provides an optimal balance between weight and thermal conductivity.
* **Blue Anodized Finish:** Not only provides a distinctive aesthetic but also improves surface emissivity and protects the aluminum from corrosion.
#### 2. pushPIN™ Attachment System
This specific model uses the **pushPIN™** system, which consists of:
* **Brass Springs:** Ensures consistent pressure (preload) for optimal thermal interface material (TIM) performance.
* **Plastic/Brass Push Pins:** Designed for quick and secure attachment to the Printed Circuit Board (PCB) through pre-drilled holes.
#### 3. Fin Design
* The **Straight Fin** geometry is optimized for air-flow efficiency. It is designed to maximize surface area while minimizing air pressure drop, making it ideal for systems with forced-air cooling (fans).
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### Application Usage
The ATS-02F-82-C2-R0 is commonly used to cool:
* **BGA (Ball Grid Array) Components:** Such as CPUs, GPUs, or FPGAs.
* **Telecommunications Equipment:** High-speed networking switches and routers.
* **Embedded Systems:** Industrial PCs and automation controllers where space is limited but heat output is high.
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### Thermal Performance Data (at Airflow)
| Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 10.79 |
| 200 (1.0 m/s) | 3.95 |
| 300 (1.5 m/s) | 2.33 |
| 400 (2.0 m/s) | 1.72 |
- ⤷
How does the pushPIN™ attachment compare to thermal adhesive or clips?
- ⤷ What type of Thermal Interface Material (TIM) is recommended for this heat sink?
- ⤷ Are there low-profile versions of the ATS-82 series available?