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  • ATS-02F-82-C2-R0

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    The **ATS-02F-82-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for efficient heat dissipation in compact electronic systems. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-02F-82-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 10.79°C/W (Natural Convection) | --- ### Core Components & Features #### 1. Material and Construction * **Aluminum Body:** Provides an optimal balance between weight and thermal conductivity. * **Blue Anodized Finish:** Not only provides a distinctive aesthetic but also improves surface emissivity and protects the aluminum from corrosion. #### 2. pushPIN™ Attachment System This specific model uses the **pushPIN™** system, which consists of: * **Brass Springs:** Ensures consistent pressure (preload) for optimal thermal interface material (TIM) performance. * **Plastic/Brass Push Pins:** Designed for quick and secure attachment to the Printed Circuit Board (PCB) through pre-drilled holes. #### 3. Fin Design * The **Straight Fin** geometry is optimized for air-flow efficiency. It is designed to maximize surface area while minimizing air pressure drop, making it ideal for systems with forced-air cooling (fans). --- ### Application Usage The ATS-02F-82-C2-R0 is commonly used to cool: * **BGA (Ball Grid Array) Components:** Such as CPUs, GPUs, or FPGAs. * **Telecommunications Equipment:** High-speed networking switches and routers. * **Embedded Systems:** Industrial PCs and automation controllers where space is limited but heat output is high. --- ### Thermal Performance Data (at Airflow) | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.79 | | 200 (1.0 m/s) | 3.95 | | 300 (1.5 m/s) | 2.33 | | 400 (2.0 m/s) | 1.72 |
    ✨ Follow-up Questions
    • ⤷ How does the pushPIN™ attachment compare to thermal adhesive or clips?
    • ⤷ What type of Thermal Interface Material (TIM) is recommended for this heat sink?
    • ⤷ Are there low-profile versions of the ATS-82 series available?