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  • ATS-02F-84-C2-R0

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    The **ATS-02F-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 35.00mm | | **Pitch** | Fine Pitch | | **Thermal Resistance** | 1.80 °C/W (at 200 LFM) | | **Flow Direction** | Vertical/Straight | --- ### Key Component Features #### 1. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or standard screws, this part uses the **pushPIN™** system. * **Benefits:** Ensures consistent pressure across the chip surface, improving thermal transfer. * **Hardware:** It typically uses brass or plastic pins with a stainless steel spring to provide a secure fit. #### 2. Fin Design (Fine Pitch) The "84" in the part number refers to a specific fin configuration. * **Efficiency:** The fins are designed to maximize surface area while maintaining a low profile. * **Airflow:** Optimized for high-velocity airflow environments (active cooling via fans). #### 3. Thermal Interface Material (TIM) The part number suffix often indicates the pre-applied thermal material. * **C2-R0:** This specific version usually comes with **T766** thermal grease or a similar phase-change material pre-applied to the base, ensuring immediate "out-of-the-box" installation. --- ### Electronic Applications This heat sink is commonly used to protect the following electronic components from thermal throttling or failure: * **CPUs/GPUs:** Small form-factor processors. * **FPGAs:** Field Programmable Gate Arrays that generate significant heat during high-speed logic operations. * **Power Transistors:** Voltage regulators and MOSFETs in power supply circuits.
    ✨ Follow-up Questions
    • ⤷What is the difference between the C1 and C2 versions of this heat sink?
    • ⤷ Can this heat sink be used with plastic push-pins instead of brass?
    • ⤷ How do I calculate the airflow required for a 1.80 °C/W thermal resistance?