The **ATS-02F-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** product line, designed to provide high-efficiency cooling for electronic components. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Characteristic | Specification | | :--- | :--- | | **Material** | Blue Anodized Aluminum | | **Dimensions (L x W)** | 32.20mm x 32.20mm | | **Height (Fin Height)** | 10.00mm | | **Thermal Resistance** | 8.91°C/W (Unducted Flow @ 200 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Pressure** | High Pressure (High performance) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Features & Electronic Application ### A. maxiFLOW™ Design The "spread fin" geometry (flaring out from the base) is engineered to maximize surface area for air convection while minimizing pressure drop. This is critical for cooling power-dense components like: * **CPUs/GPUs** in embedded systems. * **ASICs** and **FPGAs** used in networking equipment. * **Power MOSFETs** in power supply units. ### B. pushPIN™ Attachment System This part uses a specific mechanical fastening system rather than adhesive tape. * **Reliability:** Provides constant pressure for consistent thermal contact. * **Springs:** Available in various tensions to ensure the heat sink stays mounted even under vibration. * **Hole Pattern:** Requires pre-drilled holes in the PCB (Printed Circuit Board). ### C. Thermal Interface Material (TIM) The **T766** material pre-applied to the base is a phase-change material or high-performance grease. It fills the microscopic air gaps between the chip (heat source) and the aluminum base to significantly lower thermal impedance. --- ## 3. Thermal Performance (Airflow Data) Efficiency varies based on the Linear Feet per Minute (LFM) of the airflow within the enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 8.91 | | **400 (2.0 m/s)** | 5.08 | | **600 (3.0 m/s)** | 4.13 | ---