The **ATS-02F-96-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is used to dissipate heat from surface-mount components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications Below are the primary electronic and physical characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 30mm | | **Fin Style** | Straight Fin (High Surface Area) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.63°C/W (at 1.0 m/s airflow) | | **Compatibility** | Standard PCB hole patterns | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body The body is constructed from high-quality aluminum, which offers excellent thermal conductivity while remaining lightweight. The **30mm height** and straight-fin design are optimized for systems with active airflow (fans), allowing air to pass through the channels and carry heat away from the base. #### B. The pushPIN™ Attachment System Unlike adhesive-based heatsinks, the `ATS-02F-96-C2-R0` utilizes a mechanical **pushPIN™** system: * **Spring-Loaded:** Provides consistent pressure on the electronic component (TIM - Thermal Interface Material). * **Reliability:** Ensures the heatsink does not shift during vibrations or shipping. * **Installation:** Requires pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix generally indicates that the part comes with a pre-applied high-performance **Phase Change Material (PCM)** or thermal pad. This fills the microscopic air gaps between the electronic chip and the aluminum base to maximize heat transfer. --- ### 3. Electronic Application Use Cases This specific part is typically found in the following electronic environments: * **Embedded Systems:** Industrial PCs and controllers. * **Networking Gear:** Cooling for ASICs in routers and switches. * **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules) or MOSFETs. ---