The part number **ATS-02G-159-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* attachment series designed for cooling electronic components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 2.07°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design and Construction * **Heat Sink Geometry:** This model features a **Straight Fin** design. Straight fins allow for efficient airflow across the length of the sink, making it ideal for systems with directed forced-air cooling. * **Material Choice:** It is made from high-grade aluminum. While copper has higher conductivity, aluminum is preferred for this application due to its lightweight nature and cost-effectiveness. * **Blue Anodized Coating:** The blue finish isn't just aesthetic; it provides surface protection against corrosion and slightly increases emissivity for better radiant heat transfer. --- ### 3. Attachment Mechanism The "R0" designation typically implies the specific mounting hardware configuration: * **Push-Pins:** It utilizes brass push-pins that click into pre-drilled holes on a PCB (Printed Circuit Board). * **Compression Springs:** These ensure a consistent, firm pressure between the heat sink and the electronic component, which is critical for maximizing thermal transfer. * **TIM (Thermal Interface Material):** It comes with **T766** pre-applied. This is a "phase-change" or high-performance pad that fills microscopic air gaps between the component and the sink. --- ### 4. Component Application This part is commonly used in the following scenarios: 1. **Telecommunications:** Cooling high-speed switching silicon. 2. **Embedded Computing:** Protecting industrial processors in fan-less or restricted airflow chassis. 3. **Power Electronics:** Managing heat for large MOSFET arrays or power modules.