ATS-02H-159-C1-R0
AI

The **ATS-02H-159-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Body) / Blue Anodized (Finish) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 45.00 mm x 45.00 mm |
| **Height** | 10.00 mm (Low Profile) |
| **Pitch (Fins)** | COARSE-PITCH |
| **Thermal Resistance** | 10.68°C/W (at 100 LFM / 0.5 m/s) |
| **Base Material** | Aluminum |
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### 2. Key Features and Components
To understand the "electronic parts" or design elements of this assembly, we look at the mechanical integration:
* **Heat Sink Body:** Constructed from high-quality aluminum for optimal thermal conductivity. The blue anodized coating prevents corrosion and improves emissivity.
* **Fin Design:** Uses a **straight fin** (coarse pitch) geometry. This is ideal for environments where there is moderate airflow, allowing the air to pass through with lower pressure drop.
* **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, it uses a precise spring-loaded mechanism. This ensures:
* **Constant Pressure:** Maintains a consistent interface between the chip and the heat sink.
* **Easy Installation:** Pre-drilled holes in the PCB allow for secure mounting.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is the "pad" on the bottom that fills microscopic air gaps between the component and the heat sink.
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### 3. Thermal Performance Comparison
Thermal performance varies based on the airflow (velocity) in the system:
| Air Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 0.5 (100 LFM) | 10.68 |
| 1.0 (200 LFM) | 6.18 |
| 2.0 (400 LFM) | 4.47 |
| 3.0 (600 LFM) | 3.71 |
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### 4. Part Number Breakdown
Understanding the nomenclature helps in identifying the specific configuration:
* **ATS:** Advanced Thermal Solutions (Manufacturer)
* **02:** pushPIN™ Series
* **H:** Aluminum Material
* **159:** Specific Geometry/Fin Profile
* **C1:** Blue Anodized Finish
* **R0:** Revision/Standard Packaging
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What is the significance of the T766 thermal interface material used in this model?
- ⤷ How do I determine if this 45mm x 45mm heat sink fits my specific PCB layout?
- ⤷ What is the difference between coarse-pitch and fine-pitch heat sinks in electronic cooling?