Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.NET

X  

  • ATS-02H-159-C1-R0

  • AI
    The **ATS-02H-159-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body) / Blue Anodized (Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 10.00 mm (Low Profile) | | **Pitch (Fins)** | COARSE-PITCH | | **Thermal Resistance** | 10.68°C/W (at 100 LFM / 0.5 m/s) | | **Base Material** | Aluminum | --- ### 2. Key Features and Components To understand the "electronic parts" or design elements of this assembly, we look at the mechanical integration: * **Heat Sink Body:** Constructed from high-quality aluminum for optimal thermal conductivity. The blue anodized coating prevents corrosion and improves emissivity. * **Fin Design:** Uses a **straight fin** (coarse pitch) geometry. This is ideal for environments where there is moderate airflow, allowing the air to pass through with lower pressure drop. * **pushPIN™ Attachment:** Instead of messy adhesives or simple clips, it uses a precise spring-loaded mechanism. This ensures: * **Constant Pressure:** Maintains a consistent interface between the chip and the heat sink. * **Easy Installation:** Pre-drilled holes in the PCB allow for secure mounting. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is the "pad" on the bottom that fills microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance Comparison Thermal performance varies based on the airflow (velocity) in the system: | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 0.5 (100 LFM) | 10.68 | | 1.0 (200 LFM) | 6.18 | | 2.0 (400 LFM) | 4.47 | | 3.0 (600 LFM) | 3.71 | --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying the specific configuration: * **ATS:** Advanced Thermal Solutions (Manufacturer) * **02:** pushPIN™ Series * **H:** Aluminum Material * **159:** Specific Geometry/Fin Profile * **C1:** Blue Anodized Finish * **R0:** Revision/Standard Packaging
    ✨ Follow-up Questions
    • ⤷ What is the significance of the T766 thermal interface material used in this model?
    • ⤷ How do I determine if this 45mm x 45mm heat sink fits my specific PCB layout?
    • ⤷ What is the difference between coarse-pitch and fine-pitch heat sinks in electronic cooling?