The **ATS-03B-06-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is designed for high-density cooling requirements in electronic systems. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Brass Springs) | | **Dimensions (L x W x H)** | 40.00 mm x 40.00 mm x 25.00 mm | | **Thermal Resistance** | 2.50 °C/W (at 200 LFM) | | **Flow Pattern** | Straight Fin | | **Weight** | 68 grams (approx.) | --- ## 2. Key Electronic & Mechanical Features ### A. pushPIN™ Attachment System The "03B" designation typically refers to the specific attachment mechanism. This heat sink uses a **pushPIN™** system which includes: * **Brass Springs:** Ensures consistent pressure over the heat source (e.g., CPU, FPGA). * **Plastic Push Pins:** Designed for easy installation into pre-drilled holes on the PCB. * **Reliability:** Reduces the risk of the heat sink shifting due to vibration or mechanical shock. ### B. Thermal Performance The "06" in the part number indicates the fin height or configuration. The straight-fin design is optimized for: * **Airflow:** Works best in systems with directed forced-air cooling. * **Heat Dissipation:** The blue anodized finish is not just for aesthetics; it provides a slight increase in surface emissivity to aid in radiative cooling. ### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the part comes pre-applied with **ATS-PPS-02** thermal grease. This ensures: * Low thermal resistance between the component and the heat sink. * Ease of assembly, as no additional thermal paste application is required. --- ## 3. Common Applications This specific heat sink is widely used for cooling high-power semiconductors, including: 1. **Processors (CPUs/GPUs):** In embedded systems or small form factor PCs. 2. **FPGAs & ASICs:** Used in networking hardware and telecommunications. 3. **Power Supplies:** Cooling MOSFETs or large diodes in power conversion modules. ---