The **ATS-03B-08-C2-R0** is a specific electronic component known as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" series, designed for thermal management of semiconductors like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance** | 14.61 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 15mm | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **03**: Product family/series. * **B**: Fin pitch/type configuration. * **08**: Specific dimension/height code. * **C2**: Thermal Interface Material (TIM) and finish code (typically indicates T766 phase change material). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic Functions While a heat sink is a passive mechanical part, its role in an electronic circuit is critical for performance and safety: * **Heat Dissipation:** It increases the surface area of the component it is attached to, allowing heat to transfer more efficiently into the surrounding air (convection). * **Thermal Interface:** This specific model comes with **T766 TIM**, which fills microscopic air gaps between the component and the heat sink to ensure maximum heat transfer. * **Protection:** By keeping the junction temperature ($T_j$) of a semiconductor within safe limits, it prevents thermal throttling or permanent hardware failure. --- ### 4. Mounting Hardware The **pushPIN™** system used by this part includes: 1. **Brass or Plastic Pins:** Designed to fit into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide consistent pressure (force) to ensure the heat sink remains in contact with the electronic component despite vibrations or thermal expansion.