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  • ATS-03B-124-C2-R0

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    The **ATS-03B-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-03B-124-C2-R0 | | **Material** | Aluminum (typically Blue Anodized) | | **Dimensions** | 50mm x 50mm x 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | ~3.18°C/W (at 100 LFM) | | **Fin Type** | XC-Cut (Cross-cut) | --- ### 2. Key Design Features * **XC-Cut Fin Pattern:** This part utilizes a cross-cut fin design. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it ideal for systems where the direction of the cooling air might change or is turbulent. * **pushPIN™ Attachment:** The "R0" at the end of the part number indicates the attachment hardware. This model uses a plastic or brass push-pin with a stainless steel spring. This ensures: * Consistent pressure (Force) across the chip surface. * Secure mounting to the PCB via pre-drilled holes. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with high-performance thermal grease or a phase-change material (T766) to ensure optimal heat transfer from the component to the aluminum base. --- ### 3. Usage Context In an electronic circuit, the ATS-03B-124-C2-R0 acts as a **passive cooler**. It increases the surface area of the heat-generating component, allowing air (pushed by a system fan) to carry the heat away more efficiently. **Typical Applications:** * High-speed networking switches. * Industrial power supplies. * Embedded computing modules.
    ✨ Follow-up Questions
    • ⤷ What are the dimensions of the PCB holes required for the pushPIN attachment?
    • ⤷ How does the thermal resistance of this heat sink change at higher airflow speeds?
    • ⤷ What is the specific type of Thermal Interface Material (TIM) pre-applied to this model?