ATS-03B-124-C2-R0
AI

The **ATS-03B-124-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Part Number** | ATS-03B-124-C2-R0 |
| **Material** | Aluminum (typically Blue Anodized) |
| **Dimensions** | 50mm x 50mm x 25mm |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | ~3.18°C/W (at 100 LFM) |
| **Fin Type** | XC-Cut (Cross-cut) |
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### 2. Key Design Features
* **XC-Cut Fin Pattern:** This part utilizes a cross-cut fin design. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it ideal for systems where the direction of the cooling air might change or is turbulent.
* **pushPIN™ Attachment:** The "R0" at the end of the part number indicates the attachment hardware. This model uses a plastic or brass push-pin with a stainless steel spring. This ensures:
* Consistent pressure (Force) across the chip surface.
* Secure mounting to the PCB via pre-drilled holes.
* **Thermal Interface Material (TIM):** This part usually comes pre-applied with high-performance thermal grease or a phase-change material (T766) to ensure optimal heat transfer from the component to the aluminum base.
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### 3. Usage Context
In an electronic circuit, the ATS-03B-124-C2-R0 acts as a **passive cooler**. It increases the surface area of the heat-generating component, allowing air (pushed by a system fan) to carry the heat away more efficiently.
**Typical Applications:**
* High-speed networking switches.
* Industrial power supplies.
* Embedded computing modules.
- ⤷
What are the dimensions of the PCB holes required for the pushPIN attachment?
- ⤷ How does the thermal resistance of this heat sink change at higher airflow speeds?
- ⤷ What is the specific type of Thermal Interface Material (TIM) pre-applied to this model?