The **ATS-03B-152-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** line, designed to provide efficient thermal management for electronic components like CPUs, GPUs, and power modules. ### 1. Key Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 25.00mm | | **Thermal Resistance** | 3.32 °C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Flow Pattern** | Straight Fin | | **Weight** | ~50 grams | --- ### 2. Electronic Component Characteristics #### Thermal Performance The primary function of this part is to dissipate heat from electronic semiconductors. The "C2" in the part number indicates the thermal interface material (TIM) or specific performance class. * **Low Airflow (100 LFM):** 3.32 °C/W * **High Airflow (700 LFM):** 1.15 °C/W As airflow increases, the efficiency of the heat sink improves significantly, preventing thermal throttling in high-speed processors. #### Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, the **ATS-03B-152-C2-R0** uses a mechanical spring-loaded system. * **Pressure:** It provides consistent pressure across the component surface, ensuring the Thermal Interface Material (TIM) fills all microscopic gaps. * **Reliability:** It is more resistant to shock and vibration compared to tape-on heat sinks. #### Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Provides corrosion resistance and increases surface emissivity, which slightly improves radiative heat transfer. --- ### 3. Typical Applications This heat sink is sized for medium-to-large electronic packages, commonly used in: 1. **Network Switches/Routers:** Cooling ASICs. 2. **Industrial PCs:** Thermal management for embedded processors. 3. **Power Electronics:** Dissipating heat from MOSFET arrays or IGBTs. ---