The **ATS-03B-154-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed to provide high thermal performance in environments with constrained airflow. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance (Unducted)** | 4.87 °C/W @ 200 LFM | | **Thermal Resistance (Ducted)** | 3.56 °C/W | | **Fins** | Tapered Fin (High performance) | --- ## 2. Key Electronic & Mechanical Features ### A. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this model uses the **pushPIN™** system. - It consists of a flexible spring-loaded mechanism that provides a precise, pre-calculated pressure on the electronic component (CPU, GPU, or ASIC). - This ensures maximum heat transfer (Thermal Interface Material efficiency) and prevents the heat sink from shifting during vibration. ### B. maxiFLOW™ Fin Design The "electronic" advantage of the maxiFLOW design is the **tapered fin geometry**. - It increases the surface area for radiation and convection while minimizing the pressure drop. - In modern PCB layouts where components are packed tightly, this design allows air to flow through the fins more effectively even at lower fan speeds. ### C. Blue Anodized Finish The surface is treated with a blue anodized coating. While aesthetic, this serves two functional purposes in electronics: 1. **Corrosion Resistance:** Protects the aluminum from environmental degradation. 2. **Thermal Emissivity:** Enhances the radiant heat transfer compared to raw aluminum. --- ## 3. Component Applications This heat sink is typically used for cooling mid-range heat-generating components on a PCB: - **ASICs & FPGAs:** Used in networking hardware and telecommunications. - **Processors:** Low-power embedded CPUs. - **Power Supplies:** Cooling MOSFETs or power regulators in high-density environments. --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **03** | Series/Product Family | | **B** | Component Revision/Type | | **154** | Specific Geometry and Fin Density | | **C2** | Performance class and Blue Anodized finish | | **R0** | Standard Packaging/RoHS Compliant |