The **ATS-03B-155-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" component series, designed specifically for cooling electronic integrated circuits (ICs) and other heat-generating surface-mount components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Attachment Type** | pushPIN™ | | **Thermal Resistance (Flow)** | 5.37 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.97 °C/W @ 700 LFM | | **Fin Style** | Straight Fin | | **Weight** | ~45 grams | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, which offers high thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection and slightly increases emissivity for better radiant heat transfer. #### B. Attachment Mechanism (pushPIN™) The "B" in the part number signifies the attachment hardware. This part uses a spring-loaded push-pin system. * **Benefits:** Ensures constant, uniform pressure (Clip Pressure) on the electronic component. * **Reliability:** It is more secure than thermal adhesive tapes and less prone to failure under vibration. #### C. Thermal Interface Material (TIM) The **"C2"** designation typically indicates that the part comes pre-assembled with a high-performance Thermal Interface Material. This fills the microscopic air gaps between the component (CPU/GPU) and the heat sink to maximize heat flow. --- ### 3. Thermal Performance Profile Thermal resistance is measured in Celsius per Watt (°C/W). A lower value indicates better cooling performance. | Airflow Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W) - Unducted** | 5.37 | 2.50 | 1.83 | 1.51 | | **Resistance (°C/W) - Ducted** | 2.31 | 1.58 | 1.34 | 1.20 | --- ### 4. Typical Applications * **BGA (Ball Grid Array) Cooling:** Used on microprocessors and chipsets. * **Telecommunications:** Cooling of high-speed networking switches. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.