The **ATS-03B-29-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. It is manufactured by *Advanced Thermal Solutions, Inc.* --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Thermal Resistance** | 7.57°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Key Design Features #### A. Fin Design (Straight Fin) The "29" in the part number corresponds to a specific fin pattern. This heatsink typically utilizes a straight-fin or cross-cut design optimized for **forced air convection**. The geometry ensures maximum surface area contact with the air while minimizing pressure drop. #### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses the **pushPIN™** system: * **Spring-loaded mechanism:** Provides consistent pressure across the interface for optimal heat transfer. * **Hardware:** Includes a flexible pin and a high-performance compression spring. * **Reliability:** It is designed to withstand shock and vibration better than adhesive-only solutions. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates the inclusion of a pre-applied thermal interface material (like a phase-change pad or thermal grease). This eliminates the need for manual application during assembly and ensures a low thermal resistance path between the component and the heatsink. --- ### 3. Thermal Performance Matrix Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 7.57 | 2.91 | 1.85 | --- ### 4. Applications This specific heatsink is commonly found in: * **Networking Gear:** Switches and routers. * **Embedded Systems:** Industrial PC boards. * **Power Electronics:** Voltage regulators and MOSFET modules. * **Computing:** Cooling for Chipsets and BGA packages.