The **ATS-03B-33-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits (ICs). --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00 mm x 54.00 mm x 15.00 mm | | **Mounting Style** | Push-Pin (2-hole) | | **Attachment Material** | Brass (Spring-loaded) | | **Thermal Resistance** | ~1.50 °C/W (at 200 LFM) | | **Fin Pattern** | Straight | --- ### 2. Breakdown of the Model Number The model number follows a specific nomenclature used by ATS to identify the cooling capability and mechanical design: * **ATS:** Brand (Advanced Thermal Solutions). * **03B:** Indicates the specific product family/series. * **33:** Refers to the physical footprint and internal fin density configuration. * **C2:** Designates the thermal performance level and material (Aluminum with Blue Anodize). * **R0:** Revision code (Standard product line). --- ### 3. Key Electronic/Thermal Features * **Push-Pin Mounting:** This part utilizes a pre-assembled push-pin and spring mechanism. This ensures consistent pressure on the electronic component, which improves heat transfer compared to adhesive-only solutions. * **Thermal Interface Material (TIM):** Most "R0" variants come with a pre-applied thermal interface material on the base, reducing the thermal resistance between the component die and the heat sink. * **Anodized Protection:** The blue anodized finish is not just aesthetic; it provides surface protection against corrosion and slightly increases thermal emissivity. * **Airflow Optimization:** The straight-fin design is optimized for environments with forced-air cooling (fans), allowing air to flow through the channels efficiently. --- ### 4. Typical Applications This component is typically found in the following electronic systems: 1. **Network Switches/Routers:** Cooling the main processing ASIC. 2. **Power Supplies:** Heat dissipation for MOSFETs or power regulators. 3. **Industrial PCs:** Cooling embedded processors in compact enclosures.