The **ATS-03B-39-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 10mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 18.94°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | | **Fin Style** | Straight Fin | --- ## Key Components & Construction ### 1. The Heat Sink Body Constructed from high-grade aluminum, the base absorbs heat from the electronic component. The blue anodized coating is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. ### 2. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, the **-03B** variant uses brass push-pins. * **Benefits:** Provides consistent pressure on the component, ensuring better thermal contact. * **Security:** Mechanical attachment is more reliable than thermal tape in high-vibration environments. * **Springs:** Usually paired with a compression spring to ensure the force applied does not crack the silicon die. ### 3. Thermal Interface Material (T766) The "C2" in the part number indicates the specific TIM applied to the bottom. T766 is a high-performance phase-change or grease-like material that fills microscopic air gaps between the component and the heat sink. --- ## Part Number Breakdown Understanding the nomenclature helps in identifying its features: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **03**: Series identifier. * **B**: Push-pin attachment type. * **39**: Specific footprint/size code (40x40mm). * **C2**: Indicates the specific Thermal Interface Material (T766). * **R0**: RoHS compliance/revision status. --- ## Typical Applications * **Telecommunications:** Cooling networking chips and routers. * **Embedded Systems:** Industrial PCs where space is limited (low profile 10mm height). * **Power Electronics:** Cooling MOSFETs or voltage regulators.