The **ATS-03B-40-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "Blue Ice" series, specifically designed for cooling electronic components such as CPUs, GPUs, and FPGA modules. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 25mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 14.56°C/W (Unducted Flow) | | **Fin Style** | Straight Fin | | **ROHS Status** | Compliant | --- ### 2. Key Design Components #### A. Attachment Mechanism: Push-Pins Unlike adhesive-based heat sinks, this model uses a **Push-Pin** system. * **Benefits:** Provides constant pressure for better thermal interface material (TIM) performance and allows for easy removal/rework. * **Springs:** Usually paired with a compression spring to ensure the heat sink remains in contact with the chip during vibrations or thermal expansion. #### B. Material and Coating * **Aluminum Body:** Chosen for its balance between thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; the anodized surface increases the emissivity of the metal, slightly improving heat dissipation through radiation and protecting the aluminum from corrosion. #### C. Fin Geometry The **Straight Fin** design is optimized for environments where there is a clear, directional airflow (forced convection). Because the fins are 25mm high, it offers a large surface area for heat exchange compared to low-profile alternatives. --- ### 3. Thermal Performance Indicators The efficiency of this part depends heavily on the airflow speed (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 4.90 | | 400 | 2.0 | 3.20 | | 600 | 3.0 | 2.50 | --- ### 4. Application Use Cases * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial Power Supplies:** Managing heat in MOSFETs or IGBTs. * **Embedded Systems:** Used in PC104 or custom PCB builds where mechanical mounting holes are available.