The **ATS-03B-46-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below is a breakdown of the electronic and mechanical properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (High Thermal Conductivity) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight Fin (Maximized surface area) | | **Thermal Resistance** | ~11.74 °C/W (at 100 LFM) | | **Dimensions** | 25.0mm x 25.0mm x 25.0mm | | **Weight** | ~35.0 Grams | --- ### 2. Key Components & Technologies #### A. The pushPIN™ Attachment System The "03B" in the part number indicates a specific pushPIN™ assembly. This system replaces traditional adhesive tapes with a mechanical connection. * **Compression Springs:** Provide a precise amount of pressure (Force) to ensure optimal contact between the heat sink and the electronic component. * **Plastic/Brass Pins:** Inserted into pre-drilled holes on the Printed Circuit Board (PCB) for a secure fit. #### B. Thermal Interface Material (TIM) The "C2" designation refers to the thermal interface material applied to the base. * **T766 Phase Change Material:** This is pre-applied to the bottom. When the electronic part heats up, this material softens to fill microscopic air gaps between the chip and the heat sink, significantly improving heat transfer. #### C. Straight Fin Design The straight fin geometry is optimized for **forced air cooling** (environments with fans). The spacing between the aluminum fins is calculated to reduce pressure drop while maximizing the heat dissipation area. --- ### 3. Applications This part is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical space is limited to 25mm. 3. **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs). ---