The **ATS-03B-47-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to cool electronic components such as processors, GPUs, or power modules. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Thermal Resistance** | 9.30°C/W (at 200 LFM) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 12.7mm | | **Attachment Method** | Push Pin (Brass) | | **Pressure Spring** | Low Compression | --- ### 2. Electronic Application and Design The ATS-03B-47-C2-R0 is engineered for specific cooling requirements in dense electronic environments. #### Thermal Performance The heat sink features a **straight-fin** geometry. This design is optimized for environments where there is a consistent directional airflow (forced convection). The low thermal resistance (9.30°C/W) indicates it can dissipate heat efficiently, preventing thermal throttling or failure of the underlying semiconductor. #### Attachment Mechanism (Push Pin) Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system: * **Reliability:** Mechanical pins provide consistent downward pressure on the component, improving the efficiency of the Thermal Interface Material (TIM). * **Pre-drilled Holes:** This requires the Printed Circuit Board (PCB) to have specific mounting holes spaced to match the pins. * **Ease of Maintenance:** It can be removed and reapplied more easily than epoxy-bonded sinks. #### Material and Finish The use of **Aluminum** ensures a lightweight profile (preventing mechanical stress on the PCB) while maintaining high thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and increases emissivity for better radiant heat transfer. --- ### 3. Common Use Cases * **Telecommunications:** Cooling of routers and network switch chips. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Dissipating heat from high-current voltage regulators. ---